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Heat sink(CPU) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Heat sink Product List

1～15 item / All 34 items

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Fanless heat sink for Intel Socket LGA1700

Fanless heat sink for Intel Socket LGA1700

Total height 27mm, fanless heat sink cooler with a copper core heat sink with heat pipes and aluminum fins.

It can cool CPUs for Intel Socket LGA1700. 【Features】 ● Fanless CPU cooler for Intel Socket LGA1700. ● A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used to efficiently transfer heat, allowing for quick dissipation of CPU heat. ● With a height of 27mm, it is slim and ideal for 1U rack mount cases, slim cases, and compact cases where space is limited. ● This product is a fanless heatsink, so cooling performance is affected by the usage environment. It is essential to ensure airflow from an external source. It does not guarantee cooling performance. ● The installation method uses a backplate, ensuring a secure fit and close contact with the CPU. There is no worry of it falling off, allowing for safe transportation.

  • Other electronic parts

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the operating environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for substrate mounting 'PB type'

Heat sink for substrate mounting 'PB type'

A heat sink suitable for thin, lightweight, low-power CPUs. We can calculate the heat dissipation performance and propose specifications that meet your needs.

The "PB type" is a standard small and lightweight heat sink suitable for mounting on a circuit board. It has a well-balanced fin spacing and height, providing adequate heat dissipation performance for natural air cooling, making it suitable for installation on low-power CPUs under 10W. Designed for TO-220 and TO-3P type devices, it is equipped with 4.5mm pins that can be soldered to the circuit board. It can also be applied without the pins, installed parallel to the circuit board. We also offer specifications proposals using simple calculations and simulation software. 【Features】 ■ Thin and lightweight ■ Product length: 25mm (with exceptions such as 30mm depending on the model) ■ Surface treatment: Black anodized aluminum (cut surfaces and taps are not anodized) ■ Capable of proposing suitable specifications along with thermal design and custom processing *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • キャプチャ.PNG
  • Other electronic parts

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[Case Study] Optimization of Heat Sink Shape

[Case Study] Optimization of Heat Sink Shape

Introducing a case study on the optimization of heat sink shapes, which is crucial for CPU heat dissipation measures!

We would like to introduce a case study on the shape optimization of heat sinks using our "modeFRONTIER." Optimizing the heat dissipation performance of heat sinks is crucial in addressing the heat generation issues of CPUs used in computers and other devices. With the multi-objective optimization of "modeFRONTIER," we can explicitly present a lineup of heat sinks with high heat dissipation performance, each suited to the diverse product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Heat management for CPUs used in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: Using multi-objective optimization, we explicitly present a lineup of heat sinks with high heat dissipation performance suitable for diverse product shapes as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.

  • Company：IDAJ
  • Price：Other
  • Other analyses
  • simulator

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Heat Sink DHP Series

Heat Sink DHP Series

We have added the models recommended by Marusan Electric as standard products in our lineup.

We have added models recommended by Marusan Electric as standard products to our lineup. Standard products can be offered at a low price as they do not require molds. We are introducing the Intel CPU-specific types "104DHP91-91" and "104DHP90-90," as well as the 1U server types "26DHP83-106.5" and "24.5DHP90.3-90.3." For more details, please contact us or refer to the catalog.

  • Cooling system

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As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

Introducing examples of PIM utilization! We can mass-produce various shapes of heat dissipation products with excellent heat dissipation performance.

We would like to introduce a case study of PIM utilization by Atect Co., Ltd. As the CPU processing speeds of PCs and smartphones increase, the power generation has also grown, necessitating high-precision components made from ceramic materials. Our company can manufacture excellent heat dissipation and insulation components due to our unique technology that enhances thermal conductivity in ceramics, leveraging the high emissivity inherent in ceramics. We can apply various forms such as CPU heat sinks, fin-type heat sinks, pyramid-type heat sinks, pole-type heat sinks, and thin-type heat sinks. [Challenges Addressed] ■ Manufacturing high-precision components using ceramic materials *For more details, please refer to the PDF document or feel free to contact us.

  • Ceramics
  • Other electronic parts
  • Contract manufacturing

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. Mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. It features a heatsink that is integrally molded from machined aluminum ingots (the raw material state).

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Aurora Fin

Aurora Fin

Achieving weight reduction! The fin shape can be in three patterns: curl, straight, and separate.

"Aurora Fin" is ultra-fine fin processing. It significantly improves the thermal resistance value per unit volume. It achieves weight reduction with thin fin thickness and thin base thickness. It is suitable for liquid cooling of CPUs, as well as cooling for projectors using laser semiconductors and liquid cooling of power devices. 【VA・VE Effects】 ■ Ultra-fine fin processing ■ Significant improvement in thermal resistance value per unit volume ■ Weight reduction achieved with thin fin thickness and thin base thickness *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other electronic parts
  • Processing Contract

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from pure copper ingots (material in solid form) that has been machined (skyve processed) into a single molded shape.

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and compact industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink that is integrally formed by machining aluminum ingots (in a solid material state).

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments such as 1U rack-mounted servers that have blower fans installed or small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To achieve cooling, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink made from a single piece of aluminum ingot (raw material state) that has been machined (skyve processed).

  • Other electronic parts
  • Industrial PCs
  • Embedded Board Computers

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